TLSI Packaging
TLSI devices can be provided in all commercially available packages, die or wafer
Form. Shipments can be made in anti-static tubes or trays, tape and reel, or waffle pack.
TLSI also supplies product in hermetic & non-hermetic sealed packages qualified to
military environmental and quality specifications.
|
TYPE |
CONNECTIONS |
| Dual-In-Line (DIP) |
Plastic |
8-64 |
|
CERDIP |
8-48 |
| Surface Mount |
SOIC |
8-28 |
|
PLCC |
20-84 |
|
QFP |
44-304 |
|
TQFP |
32-208 |
|
BGA |
100 and up |
|
SOT23 |
3-8 |
|
SOT223 |
4 |
|
MLP |
8-64 |
|
TSSOP |
8-56 |
|
MSOP |
8-10 |
|
LCC |
18-68 |
|
Ceramic QFP |
44-164 |
| Pin Grid Array |
Plastic |
28-504 |
| Multi-Chip-Modules |
Ceramic Substrate |
|
|
FR4 Substrate |
|
|
Composite Substrate |
|
|
|
|
|
|
Home | Search | Site Map | Contact Us
|
Copyright 2000, 2004, 2005,2008 TLSI Inc. All Rights Reserved
|
Corporate Headquarters
80 Ruland Road
Melville, New York 11747
|
Phone: (631) 465-1100
Fax: (631) 465-1111
|
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